Bernhard Sell | Eric Fetzer | Vice President, Technology Development | Intel Fellow, Technology Alignment and Pathfinding, Design Engineering Group | Intel Semiconductors | Intel Semiconductors
11:30 am PT | 1:30 pm CT | 2:30 pm ET
Behind nearly 60 years of Moore’s Law lies a continuum of transistor technology breakthroughs that push the boundaries of what was once thought possible. Backside power delivery is one of those breakthroughs, a key innovation in the industry’s pursuit of ever smaller, denser, and more powerful transistors. Today, power and communication lines within a chip’s transistor architecture share the same resources. With backside power delivery, power and signals no longer compete for the same resources, enabling better-performing, more energy-efficient chips for customers. To understand the technology’s impact on continuing Moore’s Law and what it means to chip designers, Pat Moorhead catches up with Ben Sell, Vice President, Technology Development, and Eric Fetzer, Intel Fellow, Technology Alignment and Pathfinding, Design Engineering Group, on Intel’s PowerVia approach to backside power.
